SEMICONDUCTOR TESTING
The semiconductor industry demands high levels of reliability, performance and material integrity across automotive, power electronics, industrial, consumer, telecom and other critical applications.
URS Labs provides testing and characterization solutions for semiconductor devices, packages and associated materials. Leveraging our existing environmental, reliability, metallography, chemical and analytical testing infrastructure, URS supports semiconductor manufacturers, fabless companies, ATMP/OSAT facilities, component manufacturers and electronics companies during product development, qualification and failure investigation.
Our semiconductor testing services are focused on Reliability Testing, Qualification Support, Failure Analysis & Package Characterization, and Material & Chemical Characterization.
This positioning fits URS’s existing published capabilities in environmental, dynamic/reliability, metallography, analytical and RoHS testing.
PRODUCTS
SEMICONDUCTOR STANDARDS
- Integrated Circuits (ICs)
- Discrete Semiconductor Devices
- Power Semiconductors
- MOSFETs
- IGBTs
- SiC / GaN Devices
- Diodes & Rectifiers
- Transistors
- Optoelectronic Devices
- Semiconductor Packages & Modules
Power Modules - Leadframes
- Package Substrates
- Semiconductor Packaging Materials
- Electronic Components
- yASTM F 963: U.S. toy safety standard
- CPSIA -Children’s Products Safety
- RoHS (Restriction of Hazardous Substances)-electronic toy
- Third-Party Testing: Utilise accredited labs to verify safety.
- Traceability: Maintain strict documentation and product history.
- Stay Current: Monitor and adapt to evolving global regulations.
- JEDEC JESD47
- JEDEC JESD22 Series
- AEC-Q100
- AEC-Q101
- AEC-Q102
- MIL-STD-883
- ANSI/ESDA/JEDEC JS-001
- ANSI/ESDA/JEDEC JS-002
- JESD78
- IEC 62321 Series
- JEDEC JS709
- IPC/JEDEC J-STD-609
- IPC-TM-650
- ASTM E3
- ASTM E407
- IEC 60068 Series
- G Mark: Gulf Conformity and Middle East markets.
- CE Mark: EU health, safety, environmental Compliance
- CPSC: Ensuring alignment with the U.S. Consumer Product Safety Commission
- Child Safety: Protects children from physical and chemical hazards.
- Market Reach: Ensures legal access to domestic and international markets.
- Brand Trust: Builds and maintains consumer confidence.
TESTING
RELIABILITY TESTS
- Temperature Cycling
- Thermal Shock
- High Temperature
- Storage Life (HTSL)
- Low Temperature Storage
- Temperature & Humidity Testing
- Temperature Humidity Bias (THB)
- HAST / Biased HAST
- Unbiased HAST
- High Temperature Operating Life (HTOL)
- Early Life Failure Rate (ELFR)
- Power Temperature Cycling
- Mechanical Shock
- Vibration Testing
ELECTRICAL & DEVICE CHARACTERIZATION
- I-V Characterization
- Leakage Current
- Breakdown Voltage
- Threshold Voltage
- On-State Resistance – RDS(on)
- VCE(sat)
- Gate Leakage
- Forward Voltage
- Reverse Leakage
- Electrical Parametric Testing
- Pre/Post Reliability Electrical Characterization
- Functional Verification
MATERIAL & CHEMICAL CHARACTERIZATION
Semiconductor packages contain combinations of metals, polymers, molding compounds, solder materials, coatings, plating and substrates. Material characterization helps manufacturers evaluate material composition and regulatory compliance.
Tests:
- Restricted Substance Analysis
- RoHS Compliance
- Lead (Pb)
- Cadmium (Cd)
- Mercury (Hg)
- Hexavalent Chromium [Cr(VI)]
- PBB / PBDE
- Phthalates
- Material Identification
- Polymer Characterization
- Metal Composition Analysis
- Low-Halogen Material Assessment
- Package Material Analysis
- Molding Compound Analysis
- Leadframe / Terminal Material Analysis
FAILURE ANALYSIS & PACKAGE CHARACTERIZATION
Failure analysis helps semiconductor manufacturers identify defects originating from package materials, interconnections, manufacturing processes, environmental stresses and device operation.
Tests
- Metallographic Examination
- Cross-Section Analysis
- Microsection Analysis
- Package & Interconnect Examination
- Optical Microscopy
- Microstructural Analysis
- Decapsulation*
- C-SAM / Scanning Acoustic Microscopy*
- X-Ray Inspection*
- SEM/EDS Analysis*
- Wire Bond Pull*
- Ball/Bond Shear*
- Die Shear*
- Failure Investigation
QUALIFICATION TESTING
URS can support semiconductor device and package qualification programs based on applicable international and automotive requirements.
Qualification Standards
- JEDEC JESD47 – Stress-Test-Driven Qualification of Integrated Circuits
- JEDEC JESD22 Series – Semiconductor Reliability & Environmental Test Methods
- AEC-Q100 – Automotive Integrated Circuits
- AEC-Q101 – Automotive Discrete Semiconductors
- AEC-Q102 – Automotive Optoelectronic Semiconductors
- MIL-STD-883 – Microelectronic Devices
Qualification programs can include environmental stress, climatic testing, mechanical testing, electrical characterization, package analysis and failure investigation depending upon device type and applicable qualification requirements.
ENVIRONMENTAL & MECHANICAL TESTING
- High Temperature
- Low Temperature
- Temperature Cycling
- Thermal Shock
- Humidity / Damp Heat
- Vibration
- Mechanical Shock
- Combined Environmental Testing